round t ype led lamps LH2040-W90 ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-lh 2040-w90 rev. : a date : 12 - may . - 2010 lead-free parts pb l dcc
30 x -30 x 0 x 60 x 50% 75% 100% -60 x 50% 25% 0 100% 75% 25% package dimensions part no. LH2040-W90 note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation page 1/5 ligitek electronics co.,ltd. property of ligitek only thermo-shrinking tube + _ 7010 202 red line black line connector pitch=2.0 ul1007 28awg
ligitek electronics co.,ltd. property of ligitek only unit ma mw g a ma h symbol ratings parameter absolute maximum ratings at ta=25 j 60 50 i fp pd 10 ir power dissipation peak forward current duty 1/10@10khz reverse current @5v forward current i f 20 page 2/5 j -40 ~ +100 tstg storage temperature typical electrical & optical characteristics (ta=25 j ) note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. operating temperature -40 ~ +85 t opr j peak wave length f pnm viewing angle 2 c 1/2 (deg) red diffused LH2040-W90 gap red emitted 697 90 1.7 lens min. 3.0 2.6 4.5 36 typ. min. max. color part no material forward voltage @20ma(v) spectral halfwidth ??f nm luminous intensity @10ma(mcd) part no. LH2040-W90
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 500 550 600 650 0.0 0.5 1.0 h chip 3/5 part no. LH2040-W90
page 4/5 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5c/sec(max) solder bath:260 c max dipping time:3seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 60 seconds max 0x 0 25x preheat 50 2 /sec max 260x 120x temp(c) time(sec) 100 150 3 /sec max 260 c3sec max part no. LH2040-W90
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 5/5 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 j? 5 j 2.rh=90 %~95 % 3.t=240hrs ? 2hrs 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. part no. LH2040-W90
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